ASM
NEWS
Erhan Ulvan,
manager−engineering and laboratories,
Acurn Group Inc., serves as immediate past president and
chair of the FAS Nominating Committee.
Larry Hanke, FASM,
principal engineeer, Materials
Evaluation and Engineering Inc., was named chair of the
Awards Committee.
Debbie Aliya,
president, Aliya Analytical Inc., serves as
chair of the Education Committee.
Roch Shipley, FASM,
principal engineer, Professional
Analysis and Consulting Inc., serves as chair of the FAS
Finance Committee.
Michael E. Stevenson,
president, ESI, continues as
chair of the
Journal of Failure Analysis and Prevention
Edi-
torial Committee.
Veronique Vitry,
senior research and teaching asso-
ciate, UMONS, Belgium, serves as chair of the International
Relations Committee.
Aaron Slager,
engineer IV, Bell Helicopter Textron, was
named chair of the FAS Membership Outreach Committee.
AFFILIATE SOCIETIES NAME COMMITTEE CHAIRS FOR
2016-2017 TERM
In This Issue
67 Affiliate Societies Name CommitteeChairs
68 Student Board Members 71 Award Nominations 75 Chapter News 76 Members in the NewsASM
NEWS
Submit news of ASM and its members, chapters, and affiliate societies to Frances Richards, editor, ASM News | ASM International
9639 Kinsman Road | Materials Park, OH 44073 | P 440.338.5151 ext. 5563 | F 440.338.4634 | E
frances.richards@asminternational.orgContact ASM International at 9639 Kinsman Road, Materials Park, OH 44073 | P 440.338.5151 ext. 0 or 800.336.5152 ext. 0 (toll free in U.S.
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A D V A N C E D
M A T E R I A L S
&
P R O C E S S E S | F E B R U A R Y / M A R C H
2 0 1 7
6 7
T
he Boards of the Electronic Device Failure Analysis Soci-
ety (EDFAS), Failure Analysis Society (FAS), Heat Treat-
ing Society (HTS), International Metallographic Society
(IMS), and Thermal Spray Society (TSS) have appointed chairs
to each of their committees for the 2016-2017 term. Chairs for
ASM Society and General Committees and Councils appeared
in the January 2017 issue of
ASM News.
The purpose of each
committee is stated on the ASMwebsite, asminternational.org.
Click onMembership andCommittees, followedby Committee
Involvement, and then Affiliate Committees.
Electronic Device Failure Analysis
Society (EDFAS)
Zhiyong Wang,
executive director, Maximum Inte-
grated, was elected president of EDFAS.
Cheryl Hartfield,
product manager/marketer, CDH
Consulting, serves as immediate past president and chair of
the EDFAS Nominating Committee.
Mayue Xie,
engineering TD manager, Intel Corp., con-
tinues as chair of the Education Committee.
Tom Moore, FASM,
president, Waviks Inc., continues
as chair of the EDFAS Membership Committee.
Efrat Moyal,
cofounder, LatticeGear LLC, serves as co-chair.
Felix Beaudoin,
functional characterization engineer,
GlobalFoundries, is chair of the
Electronic Device Failure
Analysis
Editorial Board.
Sam Subramanian,
principal engineer, NXP Semicon-
ductors, was named chair of the Events Committee and is
general chair of ISTFA 2017.
Szu Huat Goh,
manager product diagnostic, Global-
Foundries, Singapore, was named chair of the International
Growth Committee.
Failure Analysis Society (FAS)
Burak Akyuz,
team lead−metallurgy and failure anal-
ysis, Applied Technical Services Inc., continues to serve as
FAS president.
Wang
Xie
Moore
Moyal
Beaudoin
Subramanian
Goh
Hartfield
Akyuz
Ulvan
Hanke
Aliya
Shipley
Stevenson
Vitry