November_EDFA_Digital

HIGH RESOLUTION ACOUSTIC GHz MICROSCOPY 4 ADVANCED PACKAGING FAULT ISOLATION CASE STUDIES AND ADVANCEMENT OF EOTPR 24 GEOLOCATION OF Cu WIRES DURIN G SENSITIVE IC ACID DECAPSULATIO N 30 EARLY LIFE AUTOMOTIVE ELECTRONICS FAILURES AND THEIR ROOT CAUSES 16 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS NOVEMBER 2018 | VOLUME 20 | ISSUE 4 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2017 WINNERS PAGE 61 a d e c b