February_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 1 56 Accelerated Analysis...................................................... 56 Allied High Tech........................................................ 28-29 ASM International.......................................................... 39 Checkpoint................................................................ 50-51 Hamamatsu. .................................................................... 9 Quantum Focus Instruments.......................................... 3 Semicaps........................................................................ 19 TESCAN USA Inc............................................................. 13 ULTRA TEC.................................. Inside front/back covers Zeiss.................................................... Outside back cover For advertising information and rates , contact: Erik Klingerman, National Account Manager; tel: 440.840.9826; e-mail: Erik.Klingerman@asminternational.org . Current rate card may be viewed online at asminternational.org/mediakit. INDEX OF ADVERTISERS A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST COLUMNIST Visit the Electronic Device Failure Analysis Society website edfas.org more difficult than ever. EDFA magazine is a great source of ideas and techniques, but that is just a start. Use and build on ideas you find, and, when you can, use EDFA to share innovative ideas that you develop. Call or e-mail EDFA ’s Editor or any of the Associate Editors to discuss your idea. Youwill find someone eager to listen and ready to provide honest feedback. There is nothing to lose. ABOUT THE AUTHOR David Burgess is a failure analyst and reliability engi- neer. He developed techniques and taught in those areas at Fairchild Semiconductor and Hewlett-Packard. He is the founder of Accelerated Analysis, a manufacturer and distributor of specialty failure analysis tools. David is the co-author of Wafer Failure Analysis for Yield Enhancement . A graduate of Rensselaer Polytechnic Institute and San Jose State Uni- versity, he is amember of EDFAS and has served on various ISTFA committees. David is a Senior Life Member of IEEE and was General Chairman of the 1983 International Reliability Physics Symposium (IRPS). CONTINUED FROM PAGE 55